We are are providing a series of testing and analysis services to test final product or individual part.

Below are our main testing and analysis services:
⮞ Thermal hotspot infrared analysis using FLIR camera and analysis software. This is usefull for electronics boards repair and design validation.
⮞ Cross section analysys. The part or assembly is sinked into resin, let if solidify, then cut, grinded and polished in the key planes. This will allow different measurements to confirm design or to identify validation non-conformities.
⮞ Tolerance Stack-up Calculation for design verification or root cause analysis followed by recommendation to optimize tolerances based on the cost of the manufacturing technologies of different parts.

Contact us today in case you are interested in any of these tests. We are constantly looking into ways to add more testing and analysis capabilities in the future.